Egitto, Frank D.: search on Z-Library

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1

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors

Das, Rabindra N., Egitto, Frank D., Lauffer, John M., Markovich, Voya R.

Year:

2007

Language:

english

File:

PDF, 5.75 MB

english, 2007

2

Low temperature plasma sintering of silver nanoparticles

Ma, Siyuan, Bromberg, Vadim, Liu, Liang, Egitto, Frank D., Chiarot, Paul R., Singler, Timothy J.

Journal:

Applied Surface Science

Year:

2014

Language:

english

File:

PDF, 3.46 MB

english, 2014

3

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Development of rigid-flex and multilayer flex for electronic packaging

Das, Rabindra N., Egitto, Frank D., Wilson, Bill, Poliks, Mark D., Markovich, Voya R.

Year:

2010

Language:

english

File:

PDF, 1.07 MB

english, 2010

4

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections

Das, Rabindra N., Papathomas, Konstantinos I., Lauffer, John M., Egitto, Frank D.

Year:

2007

Language:

english

File:

PDF, 5.34 MB

english, 2007

5

Radial Wafer-to-Wafer Uniformity of Plasma-Deposited Si-N Films

Egitto, Frank D.

Journal:

Journal of The Electrochemical Society

Year:

1980

Language:

english

File:

PDF, 572 KB

english, 1980

6

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Influence of carbon, metal-coated polymer, and nano powders on sintering and electrical performance of nano-micro-filled conducting adhesives for z-axis interconnections

Das, Rabindra N., Egitto, Frank D., Lauffer, John M., Poliks, Mark D., Markovich, Voya R.

Year:

2009

Language:

english

File:

PDF, 2.16 MB

english, 2009

7

Highly conductive lines by plasma-induced conversion of inkjet-printed silver nitrate traces

Bromberg, Vadim, Ma, Siyuan, Egitto, Frank D., Singler, Timothy J.

Journal:

Journal of Materials Chemistry C

Year:

2013

Language:

english

File:

PDF, 1.93 MB

english, 2013

8

Reliability Challenges in Fabrication of Flexible Hybrid Electronics for Human Performance Monitors: A System Level Study

Soman, Varun, Khan, Yasser, Zabran, Madina, Schadt, Mark, Hart, Paul, Shay, Michael, Egitto, Frank, Papathomas, Konstantinos, Yamamoto, Natasha A. D., Han, Donggeon, Arias, Ana C., Ghose, Kanad, Polik

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

Language:

english

File:

PDF, 1.68 MB

english, 2019

9

Nano‐ and micro‐filled conducting adhesives for z ‐axis interconnections: new direction for high‐speed, high‐density, organic microelectronics packaging

Das, Rabindra N., Egitto, Frank D., Markovich, Voya R.

Journal:

Year:

2008

Language:

english

File:

PDF, 608 KB

english, 2008

10

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Reliability Study and Finite Element Modeling of a Wearable Sensor Patch (WSP) to Monitor ECG Signals

Poliks, Mark, Soman, Varun, Turner, James, Schadt, Mark, Shay, Michael, Egitto, Frank

Year:

2018

Language:

english

File:

PDF, 1.18 MB

english, 2018

11

Low Temperature Plasma Sintering of Silver Nanoparticles for Potential Flexible Electronics Applications

Ma, Siyuan, Bromberg, Vadim, Egitto, Frank D., Singler, Timothy J.

Journal:

MRS Proceedings

Year:

2012

Language:

english

File:

PDF, 3.98 MB

english, 2012

12

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Package-Interposer-Package (PIP): A breakthrough Package-on-Package (PoP) technology for high end electronics

Das, Rabindra N., Egitto, Frank D., Bonitz, Barry, Poliks, Mark D., Markovich, Voya R.

Year:

2011

Language:

english

File:

PDF, 1.62 MB

english, 2011

13

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Laser processing of 3-D structures for embedded and integrated components: An application of flexible and printable nanomaterials in microelectronics

Das, Rabindra N., Egitto, Frank D., Antesberger, Timothy E., Marconi, Francesco, How Lin,, Lauffer, John M., Markovich, Voya R.

Year:

2008

Language:

english

File:

PDF, 2.75 MB

english, 2008

14

Plasma Deposition, Treatment, and Etching of Polymers || Plasma Etching of Organic Polymers

Egitto, Frank D.

Year:

1990

Language:

english

File:

PDF, 10.03 MB

english, 1990

15

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Development of biocompatible coatings on flexible electronics

Das, Rabindra N., Egitto, Frank D., Poliks, Mark

Year:

2013

Language:

english

File:

PDF, 1.66 MB

english, 2013

16

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Nano-micro filled conductive adhesive based 3D micro arrays for Z-axis interconnections

Das, Rabindra N., Lauffer, John M., Poliks, Mark D., Egitto, Frank D., Markovich, Voya R.

Year:

2008

Language:

english

File:

PDF, 2.52 MB

english, 2008

17

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - 3D-interconnect approach for high end electronics

Das, Rabindra N., Egitto, Frank D., Lauffer, John, Bonitz, Barry, Wilson, Bill, Marconi, Francesco, Poliks, Mark D., Markovich, Voya R.

Year:

2012

Language:

english

File:

PDF, 1.13 MB

english, 2012

18

Laser processing of materials: a new strategy toward materials design and fabrication for electronic packaging

Das, Rabindra N., Egitto, Frank D., Markovich, Voya R.

Journal:

Year:

2010

Language:

english

File:

PDF, 388 KB

english, 2010

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